期刊导读

半导体工艺技术用材料的试验.电子元件模塑化合

发布时间:2021-11-10     作者:网站采编

文章摘要:The document defines a method for the determination of Na, K and CA in moulding compounds for electronic components by analysis of an aqueous extract of the epoxy resin moulding compound by means of the pressure cooker test according to DIN 50456-2.#,,#

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